Ring chip will implement expansion plan from this year to 2024, including $2 billion for the construction of new factories, $1.6 billion used to increase the capacity of existing facilities. Ring chip has selected several new factory location, but has yet to make a final decision.

"We are finally compared. We have drawn up the construction of the factory, but we are still on site and the state, "ring chip, chairman and chief executive of Doris Hsu said," the talent supply and the distance with the customer, electricity costs, operating costs and government subsidies is] the factors to consider, "she added.

Hsu said, the existing facilities of additional capacity will begin from the second half of next year, the new factory will be put into operation in 2024. If we can ahead of expansion wave, can quickly grasp the terminal scientific and technological innovation opportunity, expand the scale of the leading edge, put a camp and expand business empire, create more value for customers and shareholders. Ring chip in the United States, China, Japan and South Korea, Taiwan runs 15 factories, also have three factories in Europe. Hsu comments, ring chip failed to acquire smaller with more than 4 billion euros price Siltronic. Ring chip must be in accordance with the provisions of the previous to Siltronic termination fee payment of 50 million euros. Hsu said, ring chip is in no hurry to sell its 13.7% stake in Siltronic. Even if the public takeover of Siltronic a case, the dual-track strategy is planning in advance, she is looking forward to is now able to consider the various options, to enhance the technology development, increase production capacity. Ring chip will focus on strengthening its growth, through the new production line specializing in next generation products to layout, advanced process, aimed at large size wafer and compound semiconductor, advanced process dedicated wafer in ring chip product spectrum of would increase greatly, product mix will be more optimized.