(report released party/author: Orient securities, KuaiJian, physical, ma Tang Quan xi)
1. The thin film deposition is one of the three core semiconductor process steps
Wafer manufacturing including oxidation diffusion, lithography, etching, thin film deposition, ion implantation, cleaning and polishing, metallization process of seven. Semi conductor equipment is the basis of the semiconductor manufacturing process, semiconductor equipment advanced degree directly determines the quality and efficiency of the semiconductor production. The thin film deposition equipment manufacturing technology is difficult, high threshold, is one of the three core equipment of semiconductor manufacturing process (the other two for lithography and etching equipment).
Thin film deposition equipment as one of the core equipment of wafer manufacturing, wafer manufacturing equipment investment accounted for after lithography, accounts for about 25%. According to the SEMI and Maximize Market Research statistics, in 2020, the global semiconductor equipment Market scale reached $71.2 billion, about $17.2 billion including the size of the Market for thin film deposition equipment.
According to different working principle, the thin film deposition of integrated circuits can be classified into physical vapor deposition (PVD), chemical vapor deposition (CVD) and others. Thin film deposition process development, according to the different application evolution out of PECVD, PVD sputtering technique, ALD, LPCVD equipment is used for the different technology of wafer manufacturing.
Thin film deposition equipment in CVD, the world's highest proportion, such equipment in 2020 accounted for 64%, sputtering PVD equipment accounted for 21%. CVD equipment, PECVD device type is the mainstream, technique in CVD equipment in 2020 accounted for 53%, followed by ALD equipment, accounted for 20%. (the report source: future, a think-tank,)

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2. Many factors driving domestic thin film deposition equipment requirements
Domestic production line construction greatly boost domestic equipment requirements. Semiconductor equipment market mainly dominated by the United States, Japan, the manufacturer, under the background of trade friction, semiconductor equipment demands increase, the Yangtze river product storage, Shanghai tower, smic, huahong, silan, hefei crystal, domestic fabs actively introduces domestic equipment in the process of construction of new capacity, greatly stimulating domestic demand for semiconductor equipment.
Chip technology progress and structure complicate pulled high performance film equipment needs. With the continuous development of integrated circuit, wafer manufacturing process become more motors, the complexity of the chip structure also constantly improve, more small line width is needed in the manufacturing, manufacturers require preparation of thin film varieties increased, the end user on the membrane performance requirements are also increasing. This trend has higher technical requirements on the thin film deposition equipment, the market for high-performance thin film device depends on the increase. Evolution of CVD equipment, for example, compared with the traditional APCVD, LPCVD equipment, PECVD equipment technique formed under relatively low temperature, high density, high performance film doesn't break bad film and has formed the bottom of the circuit, thin film deposition speed faster, has become a chip manufacturing thin film deposition process of the most widely used type of equipment, the future HDP