Quotes from the south Korean media reported that 15 people in the industry, said SK hynix started preparing investment back-end process facilities, in order to increase HBM3 shipments. Focus on the expansion of the encapsulated HBM3 lichuan factory.

Familiar with the personage inside course of study says, "we are preparing to introducing additional equipment surrounding the back-end processing line, it plays an important role in HBM3 production." By the end of this year, the scale of the back-end process facilities will nearly double.

The purpose of this expansion is dealing with the AI market growth needs of HBM. HBM with CPU and GPU is suitable for used to deal with the AI's high performance computing (HPC) and large-scale data center. Because of the special performance in terms of the large capacity data processing, at the same time of AI semiconductor, demand for HBM storage is also growing. Especially HBM3 is high-bandwidth memory market popular products, orders are increasing, the SK hynix plan HBM3 centered to expand production.

Due to the existing HBM is a stack of DRAM technology, therefore requires back-end processing capacity. Silicon electric pole (TSV) and MR - MUF technology is a typical example. TSV on DRAM chips out of the thousands of tiny holes, and through the vertical penetration of electrode connection chip up and down.

This year because of semiconductor market downturn, SK hynix overall equipment investment is declining, but will try to seize the HBM products such as opportunity. SK hynix performance in the first quarter of this year's conference also said: "this year the merger of the benchmark investment declined by more than 50% over last year. Instead, the plan execution leading DDR5 demand growth this year, LPDDR5, HBM3 investment products such as production, in response to the second half of the year and next year's growth."

In addition, SK hynix will also started investing in the fifth generation of HBM products "HBM3E" facilities. It is understood that SK hynix recently provide HBM3E samples to their customers. After product USES, is expected to take additional investment on a large scale production.