Recently, xi 'an, purple light the core semiconductor co., LTD. (hereinafter referred to as the "xian purple light core") in the 2023 Technology and VLSI circuit Symposium (2023 Symposium on VLSI Technology and Circuits) published technical papers - "based on the small span Hybrid Bonding and mini - TSV 135 GBps / 0.66 pJ Gbit/bit Embedded DRAM Multilayer array" (135 GBps / 0.66 pJ Gbit/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and mini - TSV). The paper is published, it is in xi 'an purple light countries core SeDRAM ® continuous innovation of the latest breakthrough direction.

VLSI meeting this year received 632 submissions around the world, in the final in 212, only two articles from China mainland companies, including 1 article is from xi 'an purple light the core of the embedded multiple array DRAM papers.


Xi 'an purple light paper's first author, vice President of the core Wang Song paper on behalf of the company

The VLSI 2023, xi 'an purple light the core of a new generation of multilayer array SeDRAM, compared with the previous generation single array structure, a new generation of technology platform is mainly adopted the Hybrid Bonding technology at low temperature (Hybrid Bonding, HB) and mini - TSV technology. The technology platform every Gbit consists of 2048 data interface, data speeds of 541 Mbps per interface, achieve industry-leading 135 GBps/Gbit pJ/bit efficiency, bandwidth and 0.66 as the superposition of multiple layers of DRAM array structure provides advanced and effective solution.


Embedded multilayer array SeDRAM schematic diagram

Xian paper corresponding author violet light, general manager of the core Jiang Xiping said, "2020 IEDM we published the first generation SeDRAM technology, we achieved after mass production of products. The release of a new generation of multilayer SeDRAM array technology, has realized the smaller resistance capacitance, greater bandwidth and capacity, can be widely used in nearly save computing, big data processing and high performance computing, etc."

Xi 'an purple light heterogeneous integration the core embedded DRAM (SeDRAM) based on the hybrid bonding technology has realized the logical units and DRAM array 3 d integration, a number of research and development has been successively in IEDM 2020, CICC 2021, ISSCC 2022 journals and published and keynote report at the meeting.