According to south Korean media reported that South Korea South Korea semiconductor chip equipment company said recently that have opened a new factory, in order to improve the yield of double TC bonding machine, this product is the production of high bandwidth memory important process equipment (HBM).

HBM is considered the next generation of dedicated high-performance artificial intelligence storage semiconductors. According to the previously reported CFM flash market, samsung will invest 1 trillion won to expand HBM capacity. SK hynix is also promoting a plan to spend about 1 trillion won to expand lichuan HBM capacity of the factory. The industry also has a watch said samsung and hynix will expand investment next year.

Reported that HBM production need to adopt double TC bonding machine, connect to multiple DRAM by hot compression method. South Korea semiconductor since 2016 began to research and development and production of the device, this year has as main business transformation.

The new factory is located in the south Korean city of incheon, South Korea semiconductor factory owns large clean room, at the same time about 50 sets of semiconductor assembly and test equipment.