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MT29F128G08AJAAAWP-Z:A FLASH-NAND

version:MT29F128G08AJAAAWP-Z:A
brand:MICRON
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产品详情

脚位/封装 TSOP-48
外包装
无铅/环保 无铅/环保
电压(伏) 2.7v-3.6v
温度规格 0°C~+70°C
速度 1 MHZ
标准包装数量
标准外箱
Number Of Words 16G
Bit Organization x8
Density 128G
Features Polyimide (if applicable)
Package TSOP I(48-pin CPL version)
Generation Feature Set 1st set of device features
Speed Grade Async only
Design Revision A
Classification 4-2-2-1 (Die-nCE-RnB-IO Channels)
Level SLC
Production Status Production
Package Material Pb-free
Interface Async only

General Description Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (DQx) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection (WP#) and monitor device status (R/B#). This Micron NAND Flash device additionally includes a synchronous data interface for high-performance I/O operations. When the synchronous interface is active, WE# becomes CLK and RE# becomes W/R#. Data transfers include a bidirectional data strobe (DQS). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). For further details, see Device and Array Organization.


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