Model:S9S12DG25F0MPVE BRAND:NXP SERIES:HCS12 pack:tray Part status:Not suitable for new designs Core processor:HCS12 speed:25MHz Coprocessor/DSP:CANbus,I2C,SCI,SPI RAM Controller:PWM,WDT Voltage:2.35V ~ 5.25V Operating temperature:A/D 16x10b Safety features:interior Encapsulation/Shell:-40°C ~ 125°C(TA) Supplier device packaging:Surface mount type description:IC MCU 16BIT 256KB FLASH 112LQFP